BE SEMICONDUCTOR
EURONEXT AMSTERDAM
NL Flag
BESI

BESI
BE SEMICONDUCTOR
NL Flag
EURONEXT AMSTERDAM
 
Next Earning
Market Cap
EPS
Div Yield
P/E
Next Earning
Market Cap
EPS
Div Yield
P/E

BESI Stock Chart

Financials

Valuation
Enterprise Value/EBITDA, TTM
Enterprise Value, FQ
Market Cap — Basic
Number of Employees
Number of Shareholders
Price/Earnings, TTM
Price/Revenue, TTM
Price/Book Ratio, FY
Price/Sales Ratio, FY
Balance Sheet
Current Ratio, FQ
Debt to Equity, FQ
Net Debt, FQ
Quick Ratio, FQ
Total Assets, FQ
Total Debt, FQ
Operating Metrics
Return on Assets, TTM
Return on Equity, TTM
Return on Invested Capital, TTM
Revenue per Employee, TTM
Price History
Average Volume (10 day)
Beta - 1 Year
Price - 52 Week High
Price - 52 Week Low
Dividends
Dividends Paid, FY
Dividends per Share, FY
Expected Annual Dividends
Dividends Yield
Margins
Net Margin, TTM
Gross Margin, TTM
Operating Margin, TTM
Pretax Margin, TTM
Income Statement
Basic EPS, Net Income
Earnings per Share, Basic, TTM
EBITDA, TTM
Gross Profit, FY
Last Annual EPS
Last Annual Revenue, FY
Net Income, FY
Total Revenue, FY
Free Cash Flow, TTM

Profile

Sector: Technology
Industry: Semiconductor Equipment & Testing
Employees: 1738
BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.

News

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