Revasum, Inc. is a United States-based company that manufactures chemical mechanical planarization (CMP), grinding and substrate manufacturing equipment for use in the production of semiconductor devices. The Company provides equipment solutions to enable single-wafer Silicon carbide (SiC) substrate grinding and polishing. Its grinders are used for backside thinning of a broad range of semiconductor and compound materials, including silicon carbide, silicon, gallium arsenide, gallium nitride, sapphire, germanium, lithium niobate, lithium tantalate, and indium phosphide. Its CMP equipment is ideal for a broad range of applications, including oxide, silicon oxide, silicon nitride, tungsten, SOI, and other thin film applications. It also provides re-manufactures equipment. It offers automated and semi-automated grinders for high-volume production and low-volume or research-and-development applications.