Shennan Circuits Co., Ltd. engages in the provision of electronic circuit technology and solutions. It operates through the following segments: Printed Circuit Board (PCB), Package Substrate, and Electronics Assembly. The PCB segment designs, develops, and manufactures high-end PCB used in communication field and data center field. The Package Substrate segment provides support, heat dissipation, and protection for the chips. The Electronics Assembly segment assembles and solders PCB, interconnects electronics, and carries out reliability tests. The company was founded on July 3, 1984 and is headquartered in Shenzhen, China.