Unisem (M) Berhad is engaged in the manufacturing of semiconductor devices. The Company is a semiconductor assembly and test services provider in Malaysia. The Company offers a suite of assembly and test services, such as wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits packaging, wafer level chipscale packaging (CSP), flipchip and radio frequency, analog, digital and mixed-signal testing services. Its services include design, assembly, test, failure analysis, electrical and thermal characterization, warehousing and drop-ship services. The Company has approximately three semiconductor packaging and testing facilities located in Ipoh, Perak, Malaysia, Chengdu, People's Republic of China (China), and Batam, Indonesia and over two wafer bumping facilities in Ipoh, Perak, Malaysia and Chengdu, China. It also has operations in the United Kingdom and the United States.